AMTECH RMA-223-LF-TF is a rosin mildly active tacky solder flux with medium activity (M1) for leaf-free applications. Formulated for syringe, stencil printing, and rework on all PCB surface finishes, can be used for BGA sphere attachment and reballing, also designed to work on all flip chip bumping and chip scale packaging sites.
Contains UV tracer allowing immediate determination if all flux residue has been fully removed from the surface – RMA-223-LF-TF will glow bright white in UV light.
To achieve better results with voiding or to reduce tombstoning, as a starting point for process optimization using RMA-223-LF-TF consider longer soaking zone, (170-220°C) for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <60 seconds.
RMA-223-LF-TF is a Rosin Mildly Active tacky flux that can be left on the board for many SMT assemblies. For applications requiring cleaning, RMA-223-LF-TF can be cleaned using commercially available flux residue removers.
Storage and Handling
Tacky flux should be stored at room temperature (20-25°C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12 month shelf life.