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Sn96.5/Ag3/Cu0.5 (T4) no-clean lead-free solder paste (SAC305) - 250g jar

Sn96.5/Ag3/Cu0.5 (T4) no-clean lead-free solder paste (SAC305) - 250g jar

Regular price $54.25 USD
Regular price $54.25 USD Sale price $54.25 USD
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Printer Operation

The following are general guidelines for stencil printer optimization (some adjustments may be necessary based on your process requirements)

Print Speed: 25-100 mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary

AMTECH Low Oxide Powder Distribution
Micon Size Type Pitch Requirements
45 - 75μ Type-2 24 mil and above
25 - 45μ Type-3 16 - 24 mil
20 - 38μ Type-4 12 - 16 mil
15 - 25μ Type-5 8 - 12 mil
5 - 15μ Type-6 5 - 8 mil
2 - 11μ Type-7 < 5 mil

Note: Type-6 and Type-7 may not be available in certain alloys. Other powder distributions are available on request.

Stencil Life

>12 hours @ 30-45% RH and 20-25 °C
~ 4 hours @ 45-75% RH and 20-25 °C


No-clean solder paste can be left on the board for many SMT assemblies. For applications requiring cleaning, paste can be cleaned using commercial flux residue removers.


Solder paste should be stored between 3-8°C (37-46°F) to obtain the maximum refrigerated shelf life of six months. Unopened solder paste stored at room temperature, 25°C (77°F) will have a one month shelf life. Syringes and cartridges should be stored vertically in the refrigerator with the dispensing tip down.

Allow 4-8 hours for solder paste to reach optimal operating temperature of 20-25°C (68-77°F). Keep the solder paste container sealed while warming the solder paste to operating temperature.


Safety Notice

This product is designed for professional audience. Information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Consumers of AMTECH products should make their own tests to determine the suitability of each product for their particular process. Manufacturer or distributors will assume no liability for results obtained or damages incurred through the application of the data presented.

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