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Sn63/Pb37 (T4) no-clean solder paste (ROL0) RMA-223 - 35g syringe

Sn63/Pb37 (T4) no-clean solder paste (ROL0) RMA-223 - 35g syringe

Regular price $24.99 USD
Regular price $24.99 USD Sale price $24.99 USD
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Printer Operation

The following are general guidelines for stencil printer optimization with RMA-223. Some adjustments may be necessary based on your process requirements

Print Speed: 25-100 mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary

AMTECH Low Oxide Powder Distribution

Micon Size Type Pitch Requirements
45 - 75μ Type-2 24 mil and above
25 - 45μ Type-3 16 - 24 mil
20 - 38μ Type-4 12 - 16 mil
15 - 25μ Type-5 8 - 12 mil
5 - 15μ Type-6 5 - 8 mil
2 - 11μ Type-7 < 5 mil

Note: Type-6 and Type-7 may not be available in certain alloys. Other powder distributions are available on request.

Stencil Life

>8 hours @ 30-45% RH and 20-25°C
~4 hours @ 45-75% RH and 20-25°C

Cleaning

RMA-223 is a Rosin Mildly Active solder paste that can be left on the board for many SMT assemblies.
For applications requiring cleaning, RMA-223 can be cleaned using flux residue removers such as
Inventec Disper 607 and Disper 610.

Storage

Solder paste should be stored between 3-8°C (37-46°F) to obtain the maximum refrigerated shelf life of six months. Unopened solder paste stored at room temperature, 25°C (77°F) will have a one month shelf life. Syringes and cartridges should be stored vertically in the refrigerator with the dispensing tip down. Allow 4-8 hours for solder paste to reach an operating temperature of 20-25°C (68-77°F). Keep the solder paste container sealed while warming the solder paste to operating temperature.

NEVER FREEZE SOLDER PASTE!

Safety Notice

This product is designed for professional audience. Information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Consumers of AMTECH products should make their own tests to determine the suitability of each product for their particular process. Manufacturer or distributors will assume no liability for results obtained or damages incurred through the application of the data presented.

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