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NC-559-V2-TF no-clean tacky solder flux for hand-soldering Tin/Lead - 50g jar

NC-559-V2-TF no-clean tacky solder flux for hand-soldering Tin/Lead - 50g jar

Regular price $49.99 USD
Regular price $49.99 USD Sale price $49.99 USD
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NC-559-V2-TF is a no-clean tacky solder flux designed with a sole purpose – hand-soldering with tin-lead (Sn/Pb) alloys. Very successful formula with a distinct pine scent and many devoted consumers worldwide. A golden standard for manual leaded rework, stencil hand-printing, BGA sphere attachment. Most popular formulation among electronics repair shops and soldering enthusiasts.

- Rosin-based, low activity no-clean tacky solder flux specifically designed for hand-operations with leaded alloys - manual Sn/Pb rework, stencil hand-printing and tin/lead BGA reballing. Suitable for any level of training, with any basic, readily available amateur soldering tools. Fills the workspace with distinctive pleasant pine scent - has been a prime choice for electronics and automotive repair industry for a decade.
- Mighty action - a noticeable booster for copper ions while wicking the workspace. High temp - quickly breaks-up lead-free joints for further leaded repair without losing properties (up to 300°C/600°F). Exceptional wetting - tames tin/lead alloy, puts an operator in control. Excellent tackiness - holds components in-place yet allowing an easy repositioning using technics like "dancing" a component with hot air. Long process window - continue a project at a later time, once heated the flux will flow again.
- Optimal viscosity - 36-68 (Malcom @ 10 RPM/25°C (x103mPa/s)) allowing smooth flow from a syringe. Halide-free (<0.05%). Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop). Loaded with fire-retardant properties step-activated or curtailed as heat increases or subsides - soldering Sn10/Pb88/Ag2 is no different from Sn63/Pb37 although alloys operate within 100°C range difference.
- ROL0 classification - non-corrosive, doesn't short components, can be left on board for multiple SMT assemblies (manufacturer recommends cleaning all flux residues at all times to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion). Clear residue can be easily removed with hot air, foam swab and basic solvents like d-limonene or isopropanol.
- Intended for professional use, packaged in various sizes of jars for convenient access with a brush or a spatula. Keep container tightly closed - flux may dry out upon extended contact with air. Store in a room temperature - do not refrigerate. Genuine product made in the USA by AMTECH MANUFACTURING LLC, every original shipment includes AMTECH Soldering Profiles card.

Some of the popular alloys supported by this product:

Compatible Alloys Liquidus Solidus
Sn42/Bi58 (Eutectic) 138°C 138°C
Sn43/Pb43/Bi14 163°C 144°C
Sn62/Pb36/Ag2 179°C 179°C
Sn62.8/Pb36.8/Ag0.4 183°C 179°C
Sn63/Pb37 (Eutectic) 183°C 183°C
Sn60/Pb40 188°C 183°C
Sn10/Pb88/Ag2 290°C 268°C


No-clean tacky flux that can be left on the board for many SMT assemblies or removed with solvents. For applications requiring cleaning this can be cleaned using commercially available flux residue removers.

Storage and Handling

Tacky flux should be stored at room temperature (20-25°C). Refrigeration is not necessary and will not extend product shelf life. For refrigerated material consider 3-4 hours to normalize in room temperature. Syringes and cartridges are best stored vertically with tip pointing down. Properly stored tacky flux has full 12-month shelf life.

Safety Notice

This product is designed for a professional audience. The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having relevant skills at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process and take safety measures. Manufacturer/resellers assume no liability for results obtained or damages incurred through the application of the data presented.


For REACH compliant process consider modern analogues.


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