The following are general guidelines for stencil printer optimization with LF-4300. Some adjustments may be necessary based on your process requirements.
Print Speed: 25-100 mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
AMTECH Low Oxide Powder Distribution
|Micon Size||Type||Pitch Requirements|
|45 – 75μ||Type-2||24 mil and above|
|25 – 45μ||Type-3||16 – 24 mil|
|20 – 38μ||Type-4||12 – 16 mil|
|15 – 25μ||Type-5||8 – 12 mil|
|5 – 15μ||Type-6||5 – 8 mil|
|2 – 11μ||Type-7||< 5 mil|
Note: Type-6 and Type-7 may not be available in certain alloys. Other powder distributions are available on request.
>8 hours @ 30-45% RH and 20-25°C
~4 hours @ 45-75% RH and 20-25°C
LF-4300 can be cleaned using deionized water at 40-60°C with a recommended water pressure of 30-50 PSI.
Solder paste should be stored between 3-8°C (37-46°F) to obtain the maximum refrigerated shelf life of six months. Unopened solder paste stored at room temperature, 25°C (77°F) will have a one month shelf life. Syringes and cartridges should be stored vertically in the refrigerator with the dispensing tip down.
Allow 4-8 hours for solder paste to reach optimal operating temperature of 20-25°C (68-77°F). Keep the solder paste container sealed while warming the solder paste to operating temperature.
NEVER FREEZE SOLDER PASTE!
This product is designed for professional audience. Information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having technical skill, at their own risk. Consumers of AMTECH products should make their own tests to determine the suitability of each product for their particular process. Manufacturer or distributors will assume no liability for results obtained or damages incurred through the application of the data presented.