AMTECH RMA-223-AS-TF is a rosin mildly active tacky solder flux for tin-lead applications. Formulated for syringe, stencil printing, and rework on all PCB surface finishes, can be used for BGA sphere attachment and reballing, also designed to work on all flip chip bumping and chip scale packaging sites.
Contains UV tracer for quick splatter detection under UV light – RMA-223-AS-TF glows bright white in UV – spot flux residue splatter in no time!
Storage and Handling Tacky flux should be stored at room temperature (20-25 °C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12 month shelf life.
This profile is designed to serve as a starting point for process optimization using RMA-223-AS-TF. To achieve better results with voiding or to reduce tombstoning, consider using a longer soaking zone, (140-180 °C) for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <60 seconds.