STIRRI-V2-TF™ no-clean rosin-based tacky soldering paste flux (ROL0) STIRRI-Amber™ Series

StirriV2-TF™ is a no-clean rosin-based tacky paste flux for electronics repair and rework using Hot Air.

Presenting Amber-Series with 24-months shelf life for professional consumers and hobby/DIY.

No-clean tacky paste flux, rosin-based formulation with pine scent, designed for electronics repair and rework.

V2 will show it's best abilities when used with MT alloys (Mid-Temp/Military-Tech - Sn60/Sn62/Sn63) and Hot Air station. Flux stays on sufficiently long without many top-ups which can be a useful time/cost saving feature for a professional soldering all day.

– ROL0 flux classification
– Fine-tuned for Tin/Lead applications by Hot Air
– Clear residue
– Excellent wetting compatibility on most board finishes
– Doesn’t short components
– Wide process window – continue where you left off at a later time, once heated the flux will flow again

Product keynotes

– Rosin-based, low activity no-clean tacky solder flux specifically designed for hand-operations with leaded alloys – manual Sn/Pb rework with hot-air. Suitable for entry level of training and any basic, readily available amateur soldering tools. Filling the workspace with a distinctive terpene/pine scent. Suitable for the electronics and automotive repair industry.

– Mighty action – a noticeable booster for copper ions while wicking the workspace. Quickly breaks-up lead-free joints for further leaded repair without losing properties (up to 300°C/600°F). Exceptional wetting – tames tin/lead alloy, puts an operator in control, solder magically flows where it has flow. Excellent tackiness – holds components in-place for “dancing” with hot air. Long process window – continue a project at a later time, once heated the flux will flow again.

– Optimal viscosity – 36-48 (Malcom @ 10 RPM/25°C (x103mPa/s)) allowing smooth flow from a syringe. Halide-free (<0.05%). Surface insulation (SIR) resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop). Loaded with fire-retardant properties step-activated as heat increases.

– ROL0 classification – non-corrosive, doesn’t short circuits, can be left on board for multiple SMT assemblies. Clear residue can be easily removed by hot air, foam swab and basic solvents like isopropanol (best practice is to clean all flux residues all the time to avoid board contamination or voltage leakage on circuits with high impedance, also non-activated residue may absorb moisture from air and subsequently cause corrosion).

– Industrial air-syringe intended for pneumatic dispensing machines – to manually control the flow use a dispensing kit (plunger and tip sold separately). Do not remove the piston/stopper! Do not discard the original nozzle cap, tighten the cap while not using the flux – flux may dry out upon extended contact with air. Keep at a room temperature – do not refrigerate.