NC-560-LF-TF no-clean tacky flux for lead-free alloys (ROL0) - 10cc syringe

Designed for lead-free alloys and ENIG boards

Low activity (L0) no-clean lead-free flux. Formulated for syringe, stencil printing, and rework on all PCB surface finishes, can be used for BGA sphere attachment and reballing, also designed to work on all flip chip bumping and chip scale packaging sites.

Recommended Profile

To achieve better results with voiding or to reduce tombstoning, as a starting point for process optimization using NC-560-LF-TF consider longer soaking zone, (170-220°C) for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <60 seconds.

Cleaning

NC-560-LF-TF can be left on the board for many SMT assemblies. For applications requiring cleaning, NC-560-LF-TF can be cleaned using commercially available flux residue removers.

Storage and Handling

Tacky flux should be stored at room temperature (20-25°C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12 month shelf life.

Compliance