AMTECH MANUFACTURING LLC
NC-560-LF-TF no-clean lead-free tacky flux for ENIG boards (ROL0) - 10g syringe bulk
NC-560-LF-TF no-clean lead-free tacky flux for ENIG boards (ROL0) - 10g syringe bulk
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Designed for lead-free alloys and ENIG boards
Low activity (L0) no-clean lead-free flux. Formulated for syringe, stencil printing, and rework on all PCB surface finishes, can be used for BGA sphere attachment and reballing, also designed to work on all flip chip bumping and chip scale packaging sites.
| Compatible Alloys | Liquidus | Solidus |
| Sn42/Bi58 (Eutectic) | 138°C | 138°C |
| Sn42/Bi57.6/Ag0.4 | 140°C | 139°C |
| Sn96.5/Ag3.0/Cu0.5 | 219°C | 217°C |
| Sn99/Ag0.3/Cu0.7 | 221°C | 217°C |
| Sn96.5/Ag3.5 (Eutectic) | 221°C | 221°C |
| Sn99.3/Cu0.7 (Eutectic) | 227°C | 227°C |
| Sn95/Sb5 | 240°C | 235°C |
| Sn95/Ag5 | 245°C | 221°C |
Recommended Profile
To achieve better results with voiding or to reduce tombstoning, as a starting point for process optimization using NC-560-LF-TF consider longer soaking zone, (170-220°C) for 60-90 seconds, with a rapid pre-heat stage. If there is evidence of solder de-wetting, consider lowering the peak reflow temperature, or reduce the time above liquidus to <60 seconds.
Cleaning
NC-560-LF-TF can be left on the board for many SMT assemblies. For applications requiring cleaning, NC-560-LF-TF can be cleaned using commercially available flux residue removers.
Storage and Handling
Tacky flux should be stored at room temperature (20-25°C). Syringes and cartridges should be stored vertically with the dispensing tip down. Properly stored tacky flux has a 12 month shelf life.
Compliance
